The Miniature Series of aluminum heatsinks are high efficiency cooling products which are ideal for omni-directional airflow. These devices may be packaged with optional thermal tape to facilitate installation of the heatsinks.

Features:

• High efficiency cooling solution for numerous surface mount devices, including hot IC packages, flip chips, BGA packages, peripheral memory/RAM, and more
• Round pin design provides extremely low thermal resistances per given volume and facilitates omnidirectional air flow to maximize heat dissipation
• Ideally suited for devices dissipating heavy heat loads or applications with space, height and/or weight constraints
• Standard product includes anodized aluminum heatsink
• Interface material and thermally conductive, double-sided adhesive tape are available for metal, plastic and ceramic packages