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Products
» Plate Fin - Aluminum
INL19001-6/1.7
Download Datasheet
EZ Snap Clip Mounting Guide
EZ Snap Video Tutorial
Standard Features
Fin Shape:
Plate
Product Material:
Aluminum
Product Finish:
Black Anodized Plating
Fits Chip:
19
Hieght
(mm)
Width
(mm)
Length
(mm)
Weight
(g)
6.3
19
19
5
Thermal Resistance Theta_SA (C/W)
200 LFM
400 LFM
600 LFM
5.5
4.6
4.1
Attachment Option (Choose One)
Please Select
None
Adhesive TIM Pad Only (3M8815)
BU+T725 - Blue Clip & Pad (1.5 - 2.0 Chip Height)
O+T725 - Orange Clip & Pad (0.9 - 1.4 Chip Height)
Y+T725 - Yellow Clip & Pad (2.1 - 2.6 Chip Height)
Price:
$3.86
# Units Included:
1
Quantity:
The INL Series of aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
Features:
Low Profile high density heatsink
High efficiency aluminum plate fin design provides low pressure-drop characteristics
Constructed of extruded aluminum AL6063 for optimum heat transfer
Ideal for linear air flow environments
Designed specifically for BGAs and other surface mount packages
Optional EZ-SnapTM mounting clip is constructed of UL94-V0 rated nylon
Use Clip Tool HS8063 to attach or remove heatsink assembly directly to BGA Chip
Finished with black anodize plating
Selected clip & thermal pad options are preassembled at the factory
© 2012 Radian Heatsinks. A division of Intricast Co, Inc. All rights reserved worldwide.
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