One of the predominant problems facing the microprocessor industry today is the efficient cooling of ICs. With ever-increasing chip speed and escalating power Wattage, thermal problems have become a significant contributor to system failure. Radian Heatsinks has designed its heatsink product lines to provide thermal solutions for the new classes of high performance DC/DC converter and BGA packages.
Radian Heatsinks uses metal alloys with high thermal conductivity to make complex structures with high aspect ratios. We provide customers with heatsink solutions for maximum heat transfer within the smallest envelopes, with the least amount of air pressure drop.
Unique manufacturing processes produce cost-effective heatsink solutions with higher densities, thinner walls, greater strength, easy package integration, design freedom and total predictability.
Radian Heatsinks' specialty is providing thermal solutions for "hot" chips, where space available on the chip is limited. The most common way to improve chip performance is to attach a heatsink to it. The heatsink is generally made of aluminum, although copper can be chosen because of its higher conductivity characteristics. A combination of aluminum and copper is also available. The choice is usually made on a price versus thermal performance basis.
In general, the way to effectively transfer the heat away from a chip is to use a heatsink with larger surface area, and increase the flow of air through the surface areas of the heatsink.
Cooling of the chip becomes more complex when considering the optimal shape of the cooling fin. Radian is unique in offering round pin, elliptical pin as well as traditional plate fin heatsinks. Frequently, with lower airflows, or when airflow is swirling, or omni directional, pin or elliptical fin heatsinks will outperform plate fin heatsinks.