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Santa Clara, CA (PRWEB)
8/15/05
-- Radian Heatsinks, a division of Intricast
Company, Inc., today unveiled a new line
of
removable
BGA fansinks. To meet growing demands
for enhanced cooling efficiencies in high-power,
high-density component packages, these off-the-shelf
coolers cater specifically to troublesome
hot spots on a variety of PC boards. Each
BGA fansink unit is provided pre-assembled,
with a fan, black anodized aluminum heatsink,
lightweight mounting clip and thermal interface
material. INF assemblies are currently offered
in five standard sizes, including 27mm,
35mm, 40mm, 42.5mm and 45mm footprints.
Alternatively, semi-custom EZ Snap™ fansinks
are also available for embedded applications
with superior power requirements. .
Easy
Installation
Like
Radian’s
passive
EZ Snap™ solutions, the new fansink
series affords customers a similar ease
of installment. Provided with a tension-mounted
BGA clip, the heatsink simply snaps on and
self aligns over the microprocessor without
compromising the existing board design or
requiring any secondary board modifications.
Once installed, the cooler maintains close
contact and constant pressure on the chip,
effectively meeting standard mechanical
shock and vibration requirements. With no
epoxies or complex mounting kits involved,
Radian’s INF fansink assemblies can
significantly reduce assembly costs at the
board-level.
Efficient
Cooling
Ideally
suited for boards with isolated hot spots
and/or limited real estate available for
thermal components, Radian’s BGA fansinks
deliver superior cooling performance in
compact, lightweight packages. With thermal
resistances of 3.62 °C/W to 1.5 °C/W
these straight fin assemblies can effectively
cool most hot ICs on today’s embedded
boards.
Versatile
Applications
All
products in Radian’s new INF series
are equipped with either a 12V or 5V fan.
With the exception of the 27mm model, standard
assemblies are provided with a 3-wire fan
for enhanced monitoring capabilities. Ranging
from 16mm to 20mm in height, these low-profile
fansinks effectively support standard ATCA
form factors and are ideally suited for
a 1U environment.
Pricing
and Availability
There
is immediate availability for all products
listed in Radian’s latest BGA Fansink
line. Fast-turnaround, small quantity orders
can be directly placed through the company’s
online store,
www.radianstore.com.
With a starting retail price of $11.86 per
piece, the INF coolers deliver powerful,
yet affordable, thermal solutions to high-performance
microprocessors and chipsets.
For volume inquiries or custom design requests,
please contact a local Sales Rep, Distributor,
or Radian’s Corporate Headquarters
for specific pricing and availability information.
Purchase INF BGA Fansinks online:
http://www.radianstore.com
Find additional product information, datasheets
and photos for Radian's
27mm
to 45mm INF Active BGA Coolers >
http://www.radianheatsinks.com/standard/bga-fansinks.html
ABOUT
INTRICAST COMPANY, INC.
Intricast Company, Inc., headquartered in
Santa Clara, California, was founded in
1974 as a premium producer of metal components.
Through the years, Intricast has grown from
servicing the early electronics and aerospace
industries in Silicon Valley to providing
complete product development solutions to
a diverse range of markets worldwide. The
Company now has two divisions: Radian Heatsinks
and
Nexus
Pacific, to best accommodate today’s
advanced microelectronics, components and
international sourcing needs worldwide.
Intricast Company has production facilities
in Santa Clara, Taiwan and China. Its offshore
subsidiary provides world class products
and pricing for higher volume programs.
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PRESS CONTACTS:
Radian Sales
radiansales@radianheatsinks.com
Radian Heatsinks
A division of
Intricast
Company, Inc.
2160 Walsh Avenue
Santa Clara, CA 95050
Tel: 408-988-6200
Fax: 408-988-0683
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