The INM-P Series of aluminum round pin BGA heatsinks are high efficiency cooling products which are ideal for omni-directional air flow. These devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.

Features:

• High efficiency aluminum round pin design provides low pressure-drop characteristics
• Constructed of forged aluminum AL6063 for optimum heat transfer
• Ideal for omni-directional air flow
• Designed specifically for BGAs and other surface mount packages
• Optional EZ-Snap™ mounting clip is constructed of UL94-V0 rated nylon
• Use clip tool HS8063 to attach or remove heatsink assembly directly to BGA chip
• Finished with black anodize plating
• Selected clip & thermal pad options are preassembled at the factory