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Passive BGA Heatsinks

Active BGA Coolers

DC/DC Converter Heatsinks

Surface Mount Heatsinks

DC/DC Converter Heatsinks

CPU Coolers

Attachment Options

Custom Cooling Services

Alphanumeric Parts List

Alphanumeric Parts List

EZ Snap Support:

Options Guide

EZ Snap Video Tutorial

Clip Mounting Guide (pdf)

 

 

Passive BGA Heatsinks mount with EZ Snap™ Mounting Clips or Thermal Tape and provide optimum cooling for various package sizes and airflow. These off-the-shelf, high-efficiency solutions are easy to install and require no special board modifications or complex assemblies.

Each lightweight assembly include the heatsink with selected clip and/or thermal tape option (for plastic, ceramic or metal packages)

 

BGA Heatsinks with Clip

Removable BGA Chipset Fansinks

INF Series Fansinks: Active BGA Coolers
for Compact, High-Perfromance Chipsets and Microprocessors

With Cross-Cut Plat Fin Extrusion Configurations

Radian's Removable BGA Fansinks provide optimum cooling for many hot ICs, including high-performance BGA chip sets and other compact surface mount devices with limited board space. These unique straight pin extrusion designs provide large fin surface areas and enable omnidirectional airflow for optimum heat transfer. Their low-profile configuration makes them ATCA-compatible and ideally suited for high density environments.

Provided pre-assembled with an efficient, no-fuss attachment clip, INF fansinks are easy to install and require no special board modifications or complex assemblies. Optional thermal interface material is available with each cooler. For extreme BGA cooling requirements, Radian also has a semi-custom line of EZ Snap plate fin fansink solutions. Please
contact us with additional size, pin shape, attachment option and custom heatsink design requests.

Click on the Part Numbers below for additional heatsink information:
  Cooler Dimensions
(millimeters)
Thermal Resistance Product Features
Part # W (mm) L (mm) H (mm) R-Theta (°C/W) Air Delivery Voltage

FA35

35.0

35.0

19.6

1.9

4.9 CFM

12V

FB35

35.0

35.0

19.6

1.9

4.6 CFM

5V

FA40

40.0

40.0

23.3

1.3

6.4 CFM

12V

FB40

40.0

40.0

23.3

1.3

6.4 CFM

5V

FA42.5

42.5

42.5

23.3

1.2

6.4 CFM

12V

FB42.5 42.5 42.5 23.3 1.2 6.4 CFM 5V
FA45 45.0 45.0 23.3 1.2 6.4 CFM 12V
FB45 45.0 45.0 23.3 1.2 6.4 CFM 5V
FC35 35.0 35.0 16.7 2.3 4.9 CFM 12V
FD35 35.0 35.0 16.7 2.3 4.9 CFM 5V
FC40 40.0 40.0 16.7 2.0 4.9 CFM 12V
FD40 40.0 40.0 16.7 2.0 4.9 CFM 5V
FC42.5 42.5 42.5 20.4 1.6 6.4 CFM 12V
FD42.5 42.5 42.5 20.4 1.6 6.4 CFM 5V
FC45 45.0 45.0 20.4 1.5 6.4 CFM 12V
FD45 45.0 45.0 20.4 1.5 6.4 CFM 5V
FE1567 1.45 2.28 12.7 2.3 4.9 CFM 12V
FF1567 1.45 2.28 12.7 2.3 4.9 CFM 5V
FE1567 1.45 2.28 18.3 1.5 4.9 CFM 12V
FF1568 1.45

2.28

18.3 1.5 4.9 CFM 5V
FE1569 1.45 2.28 24.6 1.3 4.9 CFM 12V
FF1569 1.45 2.28 24.6 1.3 4.9 CFM 5V
FE1570 1.45 2.28 29.7 1.1 4.9 CFM 12V
FF1570 1.45 2.28 29.7 1.1 4.9 CFM 5V
FE1575 2.28 2.4 16.5 1.9 6.4 CFM 12V
FF1575 2.28 2.4 16.5 1.9 6.4 CFM 5V
FE1576 2.28 2.4 22.1 1.8 6.4 CFM 12V
FF1576 2.28 2.4 22.1 1.8 6.4 CFM 5V
FE1577 2.28 2.4 28.4 1.0 6.4 CFM 12V
FF1577 2.28 2.4 28.4 1.0 6.4 CFM 5V
FE1578 2.28 2.4 33.5 0.9 6.4 CFM 12V
FF1578 2.28 2.4 33.5 0.9 6.4 CFM 5V

BGA Mounting Clip Features & Benefits:

    Easily Installed
  • No special board modifications needed
  • Easily snaps on and self-aligns
  • Saves Labor - complete assembly as shown

  • Eliminates Complex Assemblies
  • No epoxy, spring loaded pushpins or screw devices that loosen

    Secure Attachment
  • Tension-mounted clip maintains constant pressure on chip
  • Passes Shock & Vibration (test report available upon request)

Lightweight Heatsink Assembly

 
 

 

 

 

 

 

 

 

 

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