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EZ Snap Support:
Passive BGA Heatsinks
mount with EZ
Snap™ Mounting Clips or
Thermal Tape and provide optimum cooling for
various package sizes and
airflow. These off-the-shelf,
high-efficiency solutions are
easy to install and require no
special board modifications or
complex assemblies.
Each lightweight assembly
include the heatsink with
selected clip and/or thermal
tape option (for plastic,
ceramic or metal packages)
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Passive BGA Heatsinks
Mount with EZ Snap™
Clip or Thermal Tape
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Sub-Categories: |
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Select By Pin / Fin Style: |
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Round Pin / Copper
Round
Pin designs allow omni-directional airflow to
maximize heat dissipation |
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Round Pin /
Aluminum
Round
Pin designs allow omni-directional airflow to
maximize heat dissipation |
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Plate Fin /
Aluminum
Straight Fin design provides large fin surface
area to ensure optimum heat transfer. High
efficiency straight fin heatsinks for BGA chips
and other surface mount packages |
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Elliptical Fin
/ Aluminum
Elliptical Fin design provides low pressure-drop
characteristics for superior cooling performance
in a series application. Ideally suited
for swirling air flow environments or
applications where multiple heatsinks are used
in a row |
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