High Efficiency Heatsinks
for Surface Mount Devices
Optimum
Cooling Solutions for BGA packages,
hot ICs,
IGBTs, PGAs, Flip Chips
and other SM devices
In Round Pin, Elliptical Fin
& Plate Fin
Radian offers a comprehensive
range of off-the-shelf heatsinks
for various surface mount devices.
These high efficiency cooling
solutions are available in round
pin, elliptical fin and plate
fin configurations, to accommodate
diverse airflow environments.
Low-profile and high aspect
ratio designs are also available
for applications with high power
and/or special fit requirements.
Standard product assembly includes
an anodized aluminum heatsink,
with selected clip and thermal
pad options. Optional mechanical
attachments, thermally conductive
double-sided adhesive tape,
and a wide selection of thermal
pads are available for plastic,
ceramic and metal packages.
Please
contact
us with specific size, pin
shape, attachment option and
custom
heatsink design requests.
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