The F-Series of BGA Fansinks are aluminum heatsink fans and are high efficiency heatsink cooling products designed for BGA chipsets. These devices mount with EZ SnapTM mounting clips to provide optimum cooling for various package sizes. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
High efficiency aluminum cross-cut fin design provides low pressure-drop characteristics
Constructed of extruded aluminum AL6063 for optimum heat transfer
Heatsink with DC Fan for improved heat dissipation
Designed specifically for BGAs and other surface mount packages
EZ-SnapTM mounting clip is constructed of UL94-V0 rated nylon
Use clip tool HS8132 to attach (or remove) heatsink directly to BGA chip
Finished with black anodize plating
Clip & thermal pad options are pre-assembled at the factory
Ez Snap Mounting Clips are design specifically for processors and ball grid array (BGA) components. The clips attach the BGA Fansink directly to the BGA component making use of the gap created by the ball grid array (BGA) between the component underside and PCB top surface. Therefore, the EZ Snap™ clips require no holes or modifications to the PCB. They also allow for easy rework of components with fast and easy installation and removal.
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