ELLIPTICAL FIN HEATSINK

A Elliptical Fin Heatsink is designed to reduce vortex effects by minimizing the pressure loss across the heat sink. In its simplest form it can be manufactured by using an extruded platefin heatsink, and making cross-cuts at regular intervals. A better shape can be created by using the forging process to create the fin in a ellipsis shape. Compared with standard plate fin heatsink the elliptical fin heatsink offers a higher transfer of heat in environments with low airflow. Compared with a RoundPin Heatsink, the cross cuts create a larger exposed surface to transfer more heat. The elliptical fins deliver exceptional results when placed in applications that involve multiple heatsinks in parallel with one another. The fins allow a large amount of airflow to go on to the next heatsink in the chain; reducing the effect of air blocking and increasing ventilation of cool air.

Radian’s line of aluminum BGA elliptical fin heatsink are cold forged using high pressure and low temperature to ensure no air bubbles or other impurities are trapped in the material. This improves the thermal properties of the heatsink and increases the density of the material. Radian Thermal Products utilizes special open die tooling and intense pressure to produces high precision heatsinks with high aspect ratios. These high efficiency elliptical fin heatsink cooling products are ideal for linear air-flow environments.

When selecting the correct clip for a Elliptical Fin Heatsink, it is important to get a clip that is within the range of the nominal chip height. This is the chip height without the solder balls. If the nominal is not available on the chip datasheet just use (max + min)/2. Where a particular chip height is not available, the base of the BGA heatsink can be reduced to provide correct fitment. If there are any issues please contact our team to verify fitment size.