EZ Snap Mounting Clips are design specifically for processors and ball grid array (BGA) components. The clips attach the heat sink directly to the BGA component making use of the gap created by the ball grid array (BGA) between the component underside and PCB top surface. Therefore, the EZ Snap™ clips require no holes or modifications to the PCB. They also allow for easy rework of components with fast and easy installation and removal.
EZ Snap™ Clip comes in a variety of sizes and colors, depending on which heat sink is needed. The optional clip sizes particular to any heatsink are available on each product page. Unless otherwise indicated, all EZ Snap™ Clips are offered with the T710 or T725 Thermal Interface Material TIM. Some heat sinks, and fan heat sinks also have T558 as an option which is MULTIPHASE™ Thermal Interface Material. There are many types of heatsinks, and all major designs are used on our BGA heatsinks using the EZ SNAP™ Clip.








