No-Fuss Cooling Solutions Empower Compact ICs with Extended Reliability, Affordability, Performance

No-Fuss Cooling Solutions Empower Compact ICs with Extended Reliability, Affordability and Performance. Radian Heatsinks, a division of Intricast Company, Inc., today unveiled a new line of removable BGA fansinks. To meet growing demands for enhanced cooling efficiencies in high-power, high-density component packages, these off-the-shelf coolers cater specifically to troublesome hot spots on a variety of PC boards.

Radian Heatsinks, a division of Intricast Company, Inc., today unveiled a new line of removable BGA fansinks. To meet growing demands for enhanced cooling efficiencies in high-power, high-density component packages, these off-the-shelf coolers cater specifically to troublesome hot spots on a variety of PC boards. Each BGA fansink unit is provided pre-assembled, with a fan, black anodized aluminum heatsink, lightweight mounting clip and thermal interface material. INF assemblies are currently offered in five standard sizes, including 27mm, 35mm, 40mm, 42.5mm and 45mm footprints. Alternatively, semi-custom EZ Snap™ fansinks are also available for embedded applications with superior power requirements.

EASY INSTALLATION

Like Radian’s passive EZ Snap solutions, the new fansink series affords customers a similar ease of installment. Provided with a tension-mounted BGA clip, the heatsink simply snaps on and self aligns over the microprocessor without compromising the existing board design or requiring any secondary board modifications. Once installed, the cooler maintains close contact and constant pressure on the chip, effectively meeting standard mechanical shock and vibration requirements. With no epoxies or complex mounting kits involved, Radian’s INF fansink assemblies can significantly reduce assembly costs at the board-level.

EFFICIENT COOLING

Ideally suited for boards with isolated hot spots and/or limited real estate available for thermal components, Radian’s BGA fansinks deliver superior cooling performance in compact, lightweight packages. With thermal resistances of 3.62 °C/W to 1.5 °C/W these straight fin assemblies can effectively cool most hot ICs on today’s embedded boards.

VERSATILE APPLICATIONS

All products in Radian’s new INF series are equipped with either a 12V or 5V fan. With the exception of the 27mm model, standard assemblies are provided with a 3-wire fan for enhanced monitoring capabilities. Ranging from 16mm to 20mm in height, these low-profile fansinks effectively support standard ATCA form factors and are ideally suited for a 1U environment.

AVAILABILITY & PRICING

There is immediate availability for all products listed in Radian a’s latest BGA Fansink line. Fast-turnaround, small quantity orders can be directly placed through the company’s online store.

For volume inquiries or custom design requests, please contact a local Sales Rep, Distributor, or Radian’s Corporate Headquarters for specific pricing and availability information.