HEATSINK TECHNOLOGY

PCIe HEATSINK SOLUTIONS

You are here:

Home
PCIe Heatsink

HEATSINK DESIGNED FOR PCI EXPRESS CARDS

A PCIe heatsink is specifically designed for a PCI Express (Peripheral Component Interconnect Express) card, which is a high-speed serial computer expansion bus standard. Format specifications are maintained and developed by the PCI-SIG (PCI Special Interest Group), a group of more than 900 companies that also maintain the conventional PCI specifications.

As a PCIe card has a height restriction of 14.48mm this means that fin height is fairly limited for the PCIe heatsink, especially when considering that a typical BGA chip height is around 3mm including solder balls.

Airflow should also be considered for a passive solution, and if there is a spare slot then it is worth considering our PCIe Fansink or BGA Fansink line.

REQUEST QUOTE

PCIe Fansink

If airflow is an issue, a PCIe fansink has is an active heatsink that has been specifically designed for PCI card applications, but are also ideal for other low profile applications. The fansink has been modeled for pushpins, but can also be used with screws. For exact details on a particular PCIe fansink, please contact us for more information.

Radian Part Number	Type	Voltage (V)	Style	Heatsink Material	Length (mm)	Width (mm)	Height (mm)	Theta SA (°C/W)	Store
SZ05S	Pushpin	5V	Fansink	Aluminum	50	50	10.5	2.2	View
SZ05L	Pushpin	5V	Fansink	Aluminum	63.37	50	10.5	1.85	View
SZ12S	Pushpin	12V	Fansink	Aluminum	50	50	10.5	2.2	View
SZ12L	Pushpin	12V	Fansink	Aluminum	63.37	50	10.5	1.85	View
SC05S	Pushpin	5V	Fansink	Copper	50	50	10.5	1.5	View
SC05L	Pushpin	5V	Fansink	Copper	63.37	50	10.5	1.4	View
SC12S	Pushpin	12V	Fansink	Copper	50	50	10.5	1.5	View
SC12L	Pushpin	12V	Fansink	Copper	63.37	50	10.5	1.4	View

PCIe Pushpin Heatsinks

The following list of PCIe pushpin heatsinks have been specifically designed and time tested on many PCI card applications. These heatsinks have been modeled for pushpins, but can also be used with screws. For exact details on a particular heatsink, please contact us for more information.

Radian Part Number	Type	Material	Style	Width (mm)	Length (mm)	Height (mm)	Theta SA (°C/W) at 200LFM	Theta SA (°C/W) at 400LFM	Theta SA (°C/W) at 600LFM	Store
PCI1094	Pushpin	Aluminum	Cross-Cut	50	52	7.3	5.16	3.67	3	View
PCI1138	Pushpin	Aluminum	Cross-Cut	42	55	7.2	7.32	5.26	4.32	View
PCI1153	Pushpin	Aluminum	Cross-Cut	55	40	11.9	3.74	2.6	2.12	View
PCI1155	Pushpin	Aluminum	Cross-Cut	60	55	11.9	1.89	1.25	0.99	View
PCI2063	Pushpin	Aluminum	Cross-Cut	46	72.5	11	2.6	1.6	1.25	View

BGA Platefin Heatsinks for PCIe

Radian’s BGA Platefin Heatsink devices mount with EZ Snap™ to provide quick cooling solutions and do not require any board fixtures. The following list of heatsinks fit the typical PCIe height requirements. The INC series includes over hanging heatsinks which allow a larger surface area with a low profile. We also offer custom solutions that work with our EZ Snap clip if a standard size does not fit your requirement. Please contact us for more information.

Radian Part Number	Type	Material	Style	Width (mm)	Length (mm)	Height (mm)	Theta SA (°C/W) at 200LFM	Theta SA (°C/W) at 400LFM	Theta SA (°C/W) at 600LFM	Store
INL19001-10/1.7	BGA	Aluminum	Platefin	19	19	9.5	5.71	4.17	3.57	View
INL19001-6/1.7	BGA	Aluminum	Platefin	19	19	6.3	6.26	4.58	3.97	View
INL21001-10/1.7	BGA	Aluminum	Platefin	21	21	9.5	5.38	3.91	3.32	View
INL21001-6/1.7	BGA	Aluminum	Platefin	21	21	6.3	6.08	4.41	3.79	View
INL23001-10/1.7	BGA	Aluminum	Platefin	23	23	9.5	5.01	3.67	3.06	View
INL23001-6/1.7	BGA	Aluminum	Platefin	23	23	6.3	5.77	4.28	3.63	View
INL24001-10/1.7	BGA	Aluminum	Platefin	24	24	9.5	4.72	3.45	3.83	View
INL25001-10/1.7	BGA	Aluminum	Platefin	25	25	9.5	4.57	3.18	2.63	View
INL25001-6/1.7	BGA	Aluminum	Platefin	25	25	6.3	5.32	3.79	3.15	View
INL27001-10/1.7	BGA	Aluminum	Platefin	27	27	9.5	4.25	3	2.4	View
INL27001-6/1.7	BGA	Aluminum	Platefin	27	27	6.3	4.94	3.58	2.99	View
INL29001-10/1.7	BGA	Aluminum	Platefin	29	29	9.5	3.95	2.66	2.18	View
INL29001-6/1.7	BGA	Aluminum	Platefin	29	29	6.3	4.62	3.23	2.73	View
INL31001-10/1.7	BGA	Aluminum	Platefin	31	31	9.5	3.72	2.55	2.02	View
INL31001-6/1.7	BGA	Aluminum	Platefin	31	31	6.3	4.38	3.13	2.58	View
INL33001-10/1.7	BGA	Aluminum	Platefin	33	33	9.5	3.43	2.25	1.72	View
INL33001-6/1.7	BGA	Aluminum	Platefin	33	33	6.3	4.12	2.83	2.27	View
INL35001-10/1.7	BGA	Aluminum	Platefin	35	35	9.5	3.15	2.01	1.49	View
INL35001-6/1.7	BGA	Aluminum	Platefin	35	35	6.3	3.85	2.48	1.92	View
INL37.5001-10/1.7	BGA	Aluminum	Platefin	37.5	37.5	9.5	2.9	1.75	1.34	View
INL40001-10/1.7	BGA	Aluminum	Platefin	40	40	9.5	2.73	1.68	1.22	View
INL40001-6/1.7	BGA	Aluminum	Platefin	40	40	6.3	3.26	2.08	1.59	View
INL42.5001-10/1.7	BGA	Aluminum	Platefin	42.5	42.5	9.5	2.61	1.61	1.18	View
INL42.5001-6/1.7	BGA	Aluminum	Platefin	42.5	42.5	6.3	3.15	2.01	1.54	View
INL45001-10/1.7	BGA	Aluminum	Platefin	45	45	9.5	2.45	1.47	1.12	View
INL45001-6/1.7	BGA	Aluminum	Platefin	45	45	6.3	2.93	1.87	1.44	View

VISIT PCIE HEATSINK STORE

Custom PCIe Heatsink examples

As a leading manufacturer in the industry, we specialize in designing and producing high-quality heatsinks for PCIe devices. Our heatsinks are made from top-grade materials and are designed to provide optimal cooling performance for your devices.

When a standard PCIe solution does not work for your application, Radian can design a custom heatsink. Below are a few examples.

Heatsink for PCIe compute engine with a high capacity flash storage card

Scaleflux offers the ability to integrate compute engines with a high capacity Flash storage that is connected through PCIe. This innovative product dramatically increases the processing efficiency of compute-intensive functions.

Through a consultative design process we were able to meet the demands of this tough thermal environment by manufacturing a clear anodized heatsink that includes extruding, die-casting, and silk screening processes.

Aluminum Plate Fin Heatsink for PCIe Card

Our customer was designing a PCIe Card and required a low-cost solution that would both cool their chip sets and provide mechanical support of their card.

Using advanced Mechanical Design Thermal Simulation technologies, Radian quickly designed a heatsink to meet the mechanical stresses and thermal management requirements of the application. The end result is a low-cost aluminum plate fin heatsink with a milled baseplate to provide best thermal mating to the chip sets being cooled while providing appropriate clearance for all other supporting components.

Copper heatsink for PCIe Add-On card

Our customer was designing a high-end PCIe Add-On Card with a great deal of processing power and needed a low-profile thermal management solution with a low-profile to avoid conflict with other Add-On cards and not disrupt typical airflow from a wide array of possible installations. We designed a one-piece copper heatsink that provided both thermal dissipation and mechanical support for the PCIe Card.

Dual Heatsink Solution for PCI Express Application

Customer had 3 chips on the board that needed heatsink cooling dissipating 26W. Customer had 300 LFM of airflow.

Using advanced thermal analysis we designed a low-cost aluminum heatsink solution. We separated the heatsinks to minimize any bend, twist of the PCB. The Heatsinks are affixed with plastic pushpins.