37.5mm BGA Platefin Heatsink, Aluminum, 12.7mm Tall
|Part||Type||Material||Width (mm)||Length (mm)||Height (mm)||Theta SA @200LFM||Theta SA @400LFM||Theta SA @600LFM||Datasheet|
The HS1800 Series of aluminum plate fin BGA heatsinks are high efficiency heatsink cooling products which are ideal for linear air flow environments.
These devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off- the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High efficiency aluminum plate fin design
- Constructed of extruded aluminum AL6063 for optimum heat transfer
- Ideal for linear air flow environments
- Designed specifically for BGAs and other surface mount packages
- Optional EZ-Snap mounting clip is constructed of UL94-V0 rated nylon
- Finished with black anodize plating
- Selected clip & thermal pad options are pre-assembled at the factory
* Use Clip Tool HS8132 to attach or remove heatsink assembly directly to BGA Chip