$5.68

40mm BGA Platefin Heatsink, Aluminum, 8.1mm Tall

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SKU: INC400A1-8/2.0 Categories: ,

Description

40mm BGA Platefin Heatsink, Aluminum, 8.1mm Tall

Part Type Material Width (mm) Length (mm) Height (mm) Theta SA @200LFM Theta SA @400LFM Theta SA @600LFM BGA Datasheet
 INC400A1-8-2.0  BGA  Aluminum  55.9  34  8.1  3.1  1.9  1.5  Download

Radian’s INC series aluminum plate fin BGA Heatsinks are high efficiency heatsink cooling products which are ideal for linear air-flow environments. These BGA Heatsink devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off-the-shelf, high efficiency heatsink solutions are easy to install and require no special board modifications or complex assemblies. The heatsinks are constructed of extruded aluminum for optimum heat transfer. Designed specifically for BGAs and other surface mount packages then finished with black anodize plating.

Features:

  • Low profile high density heatsink
  • High efficiency aluminum plate fin design
  • Constructed of extruded aluminum AL6063 for optimum heat transfer
  • Ideal for linear air flow environments
  • Designed specifically for BGAs and other surface mount packages
  • Optional EZ-SnapTM mounting clip is constructed of UL94-V0 rated nylon
  • Finished with black anodize plating
  • Selected clip & thermal pad options are pre-assembled at the factory

Use clip tool HS8132 to attach or remove heatsink assembly directly to BGA chip

BGA Platefin datasheet

BGA heatsink Chip Height

Additional information

Type

Material

Size

Length (mm)

Width (mm)

Height (mm)

Theta SA @200LFM (˚C/W)

Theta SA @400LFM (˚C/W)

Theta SA @600LFM (˚C/W)

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