$18.43

19mm BGA Roundpin Heatsink, Copper, 14.6mm Tall

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SKU: INM19002-15PCU/2.6 Category:

Description

19mm BGA Roundpin Heatsink, Copper, 14.6mm Tall

Part Type Material Width (mm) Length (mm) Height (mm) Theta SA @200LFM Theta SA @400LFM Theta SA @600LFM INM-PCU Datasheet
 INM19002-15PCU/2.6  BGA  Copper  19  19  14.6  5.79  4.12  3.47  Download

Radian’s copper round pin BGA Heatsinks are high efficiency heatsink cooling products which are ideal for omni-directionl airflow and convection environments. These BGA Heatsink devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off-the-shelf, high efficiency heatsink solutions are easy to install and require no special board modifications or complex assemblies. The heatsinks are constructed of forged CU1100 oxygen-free copper for optimum heat transfer.

Features:

  • High efficiency copper round pin design
  • Constructed of forged CU1100 oxygen-free copper for optimum heat transfer
  • Ideal for omni-directional air flow and convection environments
  • Designed specifically for BGAs and other surface mount packages
  • Optional EZ-Snap TM mounting clip is constructed of UL94-V0 rated nylon
  • Finished with clear anti-oxidation finish
  • Selected clip & thermal pad options are pre-assembled at the factory

Use clip tool HS8132 to attach or remove heatsink assembly

INM-PCU datasheet

BGA heatsink Chip Height

Additional information

Type

Material

Length (mm)

Width (mm)

Height (mm)

Theta SA @200LFM (˚C/W)

Theta SA @400LFM (˚C/W)

Theta SA @600LFM (˚C/W)

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