$10.32

27mm BGA Roundpin Heatsink, Aluminum, 19.6mm Tall

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SKU: INM27002-20P/2.6 Category:

Description

27mm BGA Roundpin Heatsink, Aluminum, 19.6mm Tall

Part Type Material Width (mm) Length (mm) Height (mm) Theta SA @200LFM Theta SA @400LFM Theta SA @600LFM INM-P Datasheet
 INM27002-20P/2.6  BGA  Aluminum  27  27  19.6  3.1  2.2  1.9  Download

The INM-P Series of aluminum round pin BGA Heatsinks are high efficiency heatsink cooling products which are ideal for omni-directional air flow and convection environments. These devices mount with EZ SnapTM mounting clips and / or thermal tape for various package sizes and airflow. These off-the-shelf, high-efficiency solutions are easy to install and require no special board modifications or complex assemblies.

Features:

  • High efficiency aluminum round pin design provides low pressure-drop characteristics
  • Constructed of forged aluminum AL6063 for optimum heat transfer
  • Ideal for omni-directional air flow and convection environments
  • Designed specifically for BGAs and other surface mount packages
  • Optional EZ-SnapTM mounting clip is constructed of UL94-V0 rated nylon
  • Finished with black anodize plating
  • Selected clip & thermal pad options are pre-assembled at the factory

Use clip tool HS8132 to attach or remove heatsink assembly directly to BGA chip

INM-P datasheet

BGA heatsink Chip Height

Additional information

Type

Material

Length (mm)

Width (mm)

Height (mm)

Theta SA @200LFM (˚C/W)

Theta SA @400LFM (˚C/W)

Theta SA @600LFM (˚C/W)

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